Introduction

CAREER IN CHIP LEVEL REPAIR TECHNOLOGY IN IT INDUSTRIES Every year thousands of Desktop PCs, Servers, Printers, Laptops etc are being sold and these Electronics Products becomes faulty/defective during warranty as well as after warranty. As it is well known that in the First World Countries, the MNC Companies have monopoly on their products and as such they have tried to dominate the Concept of USE and Throw, secondly the cost of manpower in repairing the faulty devices are so high that the Chip Level Repair Technology can not be justified. As a result these MNC companies who are the manufacturers of Computer Systems and its Peripherals have never favoured the development of the Components Level Repair so that they can sell a complete PCB Assembly of any peripherals at high price. But in the developing and third world countries like India, the scenario is totally different due to low manpower cost and economical status. People have a tendency to get the Electronics peripherals repaired as long as possible. AVJ has been in Repair Technology of IT Peripherals at Components Level since eleven years. It took a long dedicated Research and Development to make Repair Technology feasible in India. The whole repairing can be done at 80% less cost then Card level. So the scope of Component Level Repairing is increasing day by day. Thousands of Hardware Training Institute have come up in these two decade to produce hardware Engineers for Card Level troubleshooting the faulty systems. Presently there are more than 2 lakhs Hardware Engineers working in Eastern India. But very few or rather none have come up in the field of Chip Level Repair Technology.

ADVANTAGE OF CHIP LEVEL ENGINEER OVER CARD LEVEL HARDWARE ENGINEER   The advantages of chip Level Engineer over Card Level Engineer will always be there because of better troubleshooting knowledge by understanding the measurements of parameters of ICs and discrete components of which each peripherals are made of. For example, a DMP printer’s have logic card problem, which will cost about Rs. 3000/- for a new Logic Card in order to Service it, so a Card Level Engineer will suggest to the customers to buy a new printer’s logic card where as a Chip Level Engineer will suggest to repair the faulty logic card at approx. Rs. 500/- and bill at Rs. 1500/- to the customer. Therefore the demand for the Chip Level Repairing is there all over India.

REMUNERATION OF CHIP LEVEL REPAIR ENGINEER A Chip Level Repair Engineer will get highest salary in any firm a compared to Card Level Hardware Engineer. So those who know the Chip Level Repair Technology are the prestigious and elite ones. Generally any Hardware Engineer who after learning Chip Level Repair Technology should get an increment of about 25%-30% on his salary. course content COURSE CONTENT Module – I Basic Electronics-Components Register, Inductors/Coils, Capacitors, Transformers, Relays, Fuses; Introduction about Semiconductors; General & Special Diodes – Zener Diode, Tunnel Diode, Varactor Diode, Pin Diode, Sohottkey Diode; Non-Ohmic Resistors – NTC, PTC, Varistor; Opto-Electronic Devices – LED, IR-LED, Photo-Diode, Photo-Transistor, Photo Resistor, Optocuplar; Break Down Devices – Thyristors – SCR, TRAIAC, DIAC, SCS, UJIT; Introduction to Integrated Circuits-Group- DTL, HTL, TTL, CMOS; Generation – LSI, MSI, VLSI, EXLSI; IC Packages – SIL, DIL, PLCC, SMD, BGA. Module – II Analog and Digital Electronics Analog Circuits : Rectifier Half Wave and Full Wave Circuit, Filter Circuit, Voltage Booster Circuit, DC Regulated Power Suppliers – Transistor Regulator, IC Regulator – 78xx, 79xx, LM320, LM340, LM723, Switching – AMV, BMV, MMV, IC 555, IC 556, Smitt Triger Circuit, OP-AMP ICs – LM741, LM324, LM393, LM339, Adder, Subtractor, Integrator, Multiplie, Differentiator, Introduction to Amplifiers, Buffer State & OutPut Amplifiers. Digital Electronics : Logic Gates – AND Gate, OR Gate, NAND Gate, NOR Gate, NOT Gate, X-OR Gate, X-NOR Gate; Binary Number System; Combinational Circuits – Binary Adder, Multiplexer, Demultiplexer, Subtractor Circuits, Sequential Circuits – Flip-Flops, Counters, A/D & D/A Converter Circuits. Fundamental of Micro Computers : Register, Introduction to Micro Processor – 8085, 8086; Introduction to Micro Computer System, Simple As possible (SAP) Computers. Module – III Introduction to Repair Tools and PC Hardware Introduction to Repairing Tools : Soldering & De-soldering, Hands on SMD Rework Station, Hot Bath, Use of Oscilloscope, Re-tracking of Bus, Use of Analog & Digital Multimeters & Use of Debug Card (Post Card). PC Hardware : Beep Code, BIOS and its Identification of version & equivalence & use of debug card. Types of ROM & its Connectors, Types of RAM & its Connectors, Expansion Slots, Motherboard Identification (AT, ATX, NLX, Sockets & Slots), Chipset Features, Super I/O Controller, Introduction to Processor Features, Family & Manufacturers, ADD on Cards (VGA, AGP, Audio, LAN, SCSI, Modem, TV Tuners), Block Diagram of Pentium – I/II/III/IV Motherboards, BIOS Flashing, Jumpers & DTP Switches Settings, Partitioning and Formatting of Hard Disk, DOS commands used for troubleshooting, Windows and Devices Drivers Installation. Module – IV Troubleshooting and Repairing Peripherals Faults Identification & Repairing of Motherboard (Pentium I to IV such as Intel Chipsets TX, Ex, ZX, 81OE, 815, 845 VIA chipsets VT 8601A/T, VT82C691, VT82C693, VT82586, Sis Chipsets Sis 530, Sis 630e, Sis 730), SMPS (AT & ATX of Kobian & Frontech with circuit diagram), Repairing of CD-ROM / Writer (Samsung & LG, 52X, 48X, 32X), Repairing of Floppy Disk Drives (1.44 MB Sony, Panasonic, Mitsumi), Diagnostic & Removing of Bad Sector of Seagate and Samsung Hard Disk Drives (4.3GB, 10.2GB, 20GB) using DM,Repairing of Colour Monitor (Samsung 56V, 48Bn; LG studio work 445; Microtech and Proview), Troubleshooting & Repairing of Printers (Dot Matrix : TVSE’s MSP 245,345, 240, Wipro’s LX1050, Panasonic KXP 1150; Inkjet : Epson’s Stylus 440 & C41SX, HP’s 3325, 670C, 640C; Laser : HP’s 6L Gold, 1000), Repairing of Scanner (HP’s Scanjet & Precision series, UMAX’s Astra series), Repairing of UPS (APC, Smart Power, AVO 500 VA), De-Assembling & Assembling of Laptops (IBM, Compaq, Toshiba), Introduction to TFT Technology. mobilephone chip level training CHIP LEVEL MOBILE PHONE CELLULAR PHONE REPAIR THe details of the course contents are as follows . We have trained thousands of people on mobile phone repair courses we conduct courses for corporates like nokia , samsung, sony ericson , & othe wireless companies . OUr trained students are working in leading cellular companies in india WE TRAIN PEOPLE ON CHIP LEVEL SERVICE & REPAIR OF MOBILE PHONES 1. SOLDERING 2. DESOLDERING OF COMPONENTS 3. CHECK OF VOLTAGES IN A BATTERY OF A MOBILE PHONE 4. USE OF SMD REWORK STATION 5. TRIGGERING OF BATTERIES 6. ASSEMBLING & DIS ASSEMBLING OF MOBILE PHONES 7. CHIP LEVEL SERVICING OF COMPONENTS : POWER AMPLIFIERS(PF), AUDIO IC(COBBA), CPU (MAD),POWERSUPPLY IC (CONT), CHARGING CONTROL IC (CHAPS).RF SIGNAL PROCESSOR IC( HAGAR) . ALSO well versed with SMD components replacement (capactiors, Diodes Resistors, LEDs).REBALLING & REPAIR OF BALL GRADE ARRAY ICS(BGA) 8. HARDWARE PROBLEMS: BATTERY, CHARGING, WATER DAMAGE , NETWORK ,DISPLAY , RINGER , BUZZER, AUDIO INCOMING & OUT GOING. INSERT SIM CARD ,TOTAL DEAD ETC., 9. SOFTWARE PROBLEMS : COTACT SERVICE , HANGING, PARTIAL DEAD , NETWORK , UNLOCKING, FLASHING VARIOUS SOFTWARES LIKE USR, TWISTER, TORNADO, GRIFIN, UFS, UNI BOX FOR COLOR, CAMERA , BLUE TOOTH, INFRAFED ENABLED MOBILE PHONES OF NOKIA, SAMSUNG, PANASONIC, ERICSON, SONY, SIEMENS, LG, MOTOROLA & MANY MORE